11th International Conference on Higher Education Advances (HEAd’25)
June 17 – 20, 2025 · Valencia, Spain
https://headconf.org
Scope
After the great success of the last HEAd conferences, with more than 250 participants from more than 50 countries, we are pleased to announce the 11th International Conference on Higher Education Advances (HEAd’25).
This conference is a consolidated forum for researchers and practitioners to exchange ideas, experiences, opinions and research results relating to the preparation of students, teaching/learning methodologies and the organization of educational systems.
The HEAd’25 conference will be held fully in-person on June 17-20, 2025 on the Faculty of Business Administration and Management of the Universitat Politècnica de València (UPV), which has been recently ranked as the best technical university in Spain by the Academic Ranking of World Universities (ARWU) 2024.
Topics of interest
The program committee encourages the submission of articles that communicate applied and empirical findings of interest to higher education professionals. Topics of interest include, but are not limited to, the following topic areas:
- Innovative teaching and learning experiences
- Evaluation and assessment
- Emerging educational technologies (e.g., Artificial Intelligence, Virtual Reality, Augmented Reality)
- E-learning strategies and methodologies
- New trends in HE research (e.g. new methodologies, topics)
- Experiences outside the classroom (e.g., placements, mobility)
- New teaching and learning theories and models
- Globalization and internationalization
- Comparative education
- Managment and economics of education
- Employability and entrepreneurship
- Competency-based education
- Sustainability and SDGs in higher education
- STEM and health education
Publications
All accepted papers will appear in the conference proceedings with a DOI and ISBN number. They will be published in open access by UPV Press and submitted to be indexed in major international bibliographic databases. Previous editions are indexed in Scopus and the Clarivate Web of Science Core Collection – Conference Proceedings Citation Index.
Important Dates
Submission deadline: 31 January 2025
Author notification: 2 April 2025
Camera ready due: 23 April 2025
Workshops: 17 June 2025
Conference dates: 18-20 June 2025
Awards
The HEAd’25 Program Committee will select the winners for the Best Paper and Best Student Paper awards. To be eligible for the best student paper award, the presenting author of the paper must be a full-time student.
Submission guidelines
Authors worldwide are invited to submit original and unpublished papers, which are not under review in any other conference or journal. All submissions must be in English and formatted as PDF documents. To ensure proper formatting, please consult the template, available in Microsoft Word format at the following link:
https://headconf.org/template.docx
Papers must be between 4 to 8 pages in length, with page dimensions of 170 by 240 mm. The page count includes the title page, comprising the title, abstract, and keywords, as well as the main text, references, figures, and tables. Only manuscripts adhering strictly to the template will undergo peer review by the scientific committee. Evaluation criteria encompass originality, significance, methodological rigor, and clarity of presentation. By submitting a paper, the authors confirm that at least one of them is committed to registering, participating in the conference, and presenting the paper.
For the submission process, HEAd’25 uses the OCS platform provided by UPV Press. To submit a paper, the author must first set up an OCS account. Once registered, OCS will offer a dedicated submission portal where the author can upload the manuscript. The submission portal can be accessed here:
https://headconf.org/submission-instructions/
The organizing committee is excited about your potential involvement in an enriching conference, filled with engaging discussions and valuable networking opportunities, all aimed at promoting high-quality education. Authors are warmly welcome to share their contributions.